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主页 旧刊 有关人员 未来大会 American Society of Thermal and Fluids Engineering
Second Thermal and Fluids Engineering  Conference

ISSN: 2379-1748
ISBN: 978-1-56700-430-4

STUDY OF THERMAL TRANSPORT AND THERMAL STRESS IN THIN METAL FILM-GLASS SUBSTRATE SYSTEM

Weigang Ma
Key Laboratory for Thermal Science and Power Engineering of Ministry of Education, Department of Engineering Mechanics, Tsinghua University, Beijing 100084, China

Cheng Dong
Key Laboratory for Thermal Science and Power Engineering of Ministry of Education, Department of Engineering Mechanics, Tsinghua University, Beijing 100084, China

Shen Yan
Key Laboratory for Thermal Science and Power Engineering of Ministry of Education, Department of Engineering Mechanics, Tsinghua University, Beijing 100084, China; Department of Thermal Engineering, Tsinghua University, Beijing 100084, China

Wei Wang
Key Laboratory for Thermal Science and Power Engineering of Ministry of Education, Department of Engineering Mechanics, Tsinghua University, Beijing 100084, China

Xing Zhanga
Key Laboratory for Thermal Science and Power Engineering of Ministry of Education, Department of Engineering Mechanics, Tsinghua University, Beijing 100084, China

摘要

Solid state thermoelectric devices are desirable for various sustainable applications. Most of these thin film devices are multilayered structures which requires thorough understanding of thermal transport and thermal stress in order to solve thermal issues. In this paper the experimental technology as well as theoretical model of long delay time pump-probe study with four different illumination configurations have been developed to comprehensively characterize the thermal transport and thermal stress of thin film, substrate and the interface. Furthermore, Pt and Mo films-glass substrate systems have been studied by applying time-domain thermoreflectance measurements under four illumination configurations with high signal quality. The obtained time-dependent temperature signal is superposed by the effects of multilayered thermal transport and thermal stress spontaneously, and the corresponding theoretical predictions match well with the experimental data in the whole delay time range. The determined thermal conductivity of the Pt and Mo films shows significant size effect.

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