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主页 旧刊 有关人员 未来大会 American Society of Thermal and Fluids Engineering

Heat Transfer and Thermal Processes in Electronics and Power Applications

内容

POOL BOILING HEAT TRANSFER ENHANCEMENT USING SINTERED PARTICLE WICK STRUCTURE
Smreeti Dahariya, Athul J Pai, Gisuk Hwang, Amy Rachel Betz
pages 1269-1278
DOI: 10.1615/TFEC2019.epa.027387
$20.00
CREATING VORTEX GENERATORS USING PREFERENTIAL SURFACE WETTABILITY PATTERNING FOR AIR-SIDE HEAT TRANSFER ENHANCEMENT
Andrew E. Koopman, Christian J. L. Hermes, Andrew D. Sommers
pages 1279-1288
DOI: 10.1615/TFEC2019.epa.027602
$20.00
EXPERIMENTAL STUDY ON STABILITY OF DIFFERENT NANOFLUIDS BY USING DIFFERENT NANOPARTICLES AND BASEFLUIDS
Harkirat Sandhu, Dasaroju Gangacharyulu, Mani Kanwar Singh
pages 1289-1297
DOI: 10.1615/TFEC2019.epa.027991
$20.00
THERMAL AND HYDRAULIC PERFORMANCE OF LONGITUDINAL PERFORATED RECTANGULAR FINS WITH PERFORATION SHAPE AND SIZE VARIATIONS
Hamid Maleki, Mohammad Reza Safaei, Arturo S. Leon, Truong Khang Nguyen
pages 1299-1306
DOI: 10.1615/TFEC2019.epa.027962
$20.00