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主页 旧刊 有关人员 未来大会 American Society of Thermal and Fluids Engineering
First Thermal and Fluids Engineering Summer Conference

ISSN: 2379-1748
ISBN: 978-1-56700-430-4

BOILING HEAT TRANSFER ENHANCEMENT ON STRUCTURED SURFACES WITH ENGINEERED THERMAL GRADIENTS AND NUCLEATION SITES

Md Mahamudur Rahman
Department of Mechanical Engineering and Mechanics Drexel University, 3141 Chestnut Street, Philadelphia, PA 19104, USA

Emre Olceroglu
Department of Mechanical Engineering and Mechanics Drexel University, 3141 Chestnut Street, Philadelphia, PA 19104, USA

Matthew McCarthy
Department of Mechanical Engineering and Mechanics Drexel University, 3141 Chestnut Street, Philadelphia, PA 19104, USA

DOI: 10.1615/TFESC1.mph.012980
pages 1747-1750


键词 Pool Boiling, Microstructures, Nanostructures

摘要

Pool boiling heat transfer has been investigated using a novel enhancement technique based on in-plane variations in surface thermal conductivity. By embedding regions of low-conductivity epoxy within a high-conductivity copper substrate increases in critical heat flux (CHF) of up to 100%, and heat transfer coefficient (HTC) of over 400% at moderate superheats have been achieved as compared to bare copper surfaces. The combination of nanostructured coatings onto the novel 'bi-conductive' surfaces yields additional enhancements in both CHF and HTC. Hydrothermally grown copper oxide (CuO) nanostructures as well as biotemplated nickel nanostructures have been used to create surfaces with heterogeneous architectures, demonstrating CHF up to 307 W/cm2 and HTC of up to 250 kW/m2K. The role of each component and their combinations has been investigated, leading to insights into the underlying enhancement mechanisms.

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