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Second Thermal and Fluids Engineering  Conference

ISSN: 2379-1748
ISBN: 978-1-56700-430-4

NUMERICAL ANALYSIS OF RECTANGULAR CHANNEL HEAT SINK PERFORMANCE FOR SUPERCOMPUTING APPLICATIONS

Xudong An
Advanced Micro Devices, Inc., Austin, TX, 78735; Department of Mechanical Engineering, University of Texas at Dallas, Richardson, TX, 75080

Manish Arora
Advanced Micro Devices, Inc., Austin, TX, 78735

Wei Huang
Advanced Micro Devices, Inc., Austin, TX, 78735

Indrani Paul
Advanced Micro Devices, Inc., Austin, TX, 78735

William C. Brantley
Advanced Micro Devices, Inc., Austin, TX, 78735

Fatemeh Hassanipour
Department of Mechanical Engineering, University of Texas at Dallas, Richardson, TX, 75080

Abstract

As we approach exascale supercomputing era, the power consumed by single socket is becoming higher. Air cooling, as one of the most widely deployed cooling solution, remains an important area of investigation. For supercomputer applications, the most popular style of heat sink design is rectangular channel. In this paper, a high power CPU socket (100W) is used as heat source object and we investigate the effects of parameters of rectangular channel heat sink on cooling performance by using ANSYS ICEPAK. The parameters include heat sink length (8 - 14cm), width (8 - 12cm), height (2 - 4cm), and the number of fins (15 - 35 pieces). We perform analysis over air flow rate of 20 - 100 cubic feet per minute. The paper contains comparison of thermal resistance and CPU surface temperature under different conditions. Our research demonstrates that when air at the same flow rate blows through cross section of heat sink, thermal resistance of the heat sink and temperature of CPU surface is reduced by (1) increasing the number of fins or extending the heat sink length, while the number of fins has more influence; (2) narrowing the heat sink width and keeping other dimensions constant. The result also shows that changing the height of heat sink makes no distinguished difference on thermal resistance. The study aims at achieving optimization of air flow rate, heat sink dimension and CPU cooling performance. The insights presented are significant for supercomputer rack design, CPU arrangement and air fan selection.

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