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Second Thermal and Fluids Engineering  Conference

ISSN: 2379-1748
ISBN: 978-1-56700-430-4

MICROCHANNEL COOLING OF MICROPROCESSOR WITH NON-UNIFORM HEAT FLUX USING POROUS MEDIA THERMAL MODELLING

Akshay Iyer
Northwestern University

Dudong Feng
Department of Mechanical Engineering, Carnegie Mellon University, Pittsburgh, PA 15213, USA

Abstract

3D conjugate thermal modelling has been the industry benchmark hitherto for microchannel cooling of electronics but it involves dense mesh and extensive computational resources. This article goes beyond the conventional design process and uses porous media thermal modelling for designing a cooling system. A numerical model is developed in COMSOL Multiphysics with water as coolant and temperature dependent properties. A four-step design strategy for an optimized cooling system is outlined and a specific example comprising 8 core processor Intel Xeon Processor with highly non-uniform heat flux distribution is discussed. Previous research assumed creeping flow conditions for studying inlet/outlet location and design; this may not be true in practical cases. To overcome this hurdle, we present a methodology to design the inlet/outlet which doesn't necessitate this assumption and can be used in conjunction with porous media modelling technique. Rectangular and triangular U-type inlet/outlet configuration is studied using the presented methodology. The optimized design provides for better cooling in high heat flux core regions and prevents large thermal gradients. Overall, this procedure allows for computationally fast and accurate design for microprocessor cooling.

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