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4th Thermal and Fluids Engineering Conference

ISSN: 2379-1748

Heat Transfer and Thermal Processes in Electronics and Power Applications

Table of Contents:

POOL BOILING HEAT TRANSFER ENHANCEMENT USING SINTERED PARTICLE WICK STRUCTURE
Smreeti Dahariya, Athul J Pai, Gisuk Hwang, Amy Rachel Betz
pages 1269-1278
DOI: 10.1615/TFEC2019.epa.027387
$20.00
CREATING VORTEX GENERATORS USING PREFERENTIAL SURFACE WETTABILITY PATTERNING FOR AIR-SIDE HEAT TRANSFER ENHANCEMENT
Andrew E. Koopman, Christian J. L. Hermes, Andrew D. Sommers
pages 1279-1288
DOI: 10.1615/TFEC2019.epa.027602
$20.00
EXPERIMENTAL STUDY ON STABILITY OF DIFFERENT NANOFLUIDS BY USING DIFFERENT NANOPARTICLES AND BASEFLUIDS
Harkirat Sandhu, Dasaroju Gangacharyulu, Mani Kanwar Singh
pages 1289-1297
DOI: 10.1615/TFEC2019.epa.027991
$20.00
THERMAL AND HYDRAULIC PERFORMANCE OF LONGITUDINAL PERFORATED RECTANGULAR FINS WITH PERFORATION SHAPE AND SIZE VARIATIONS
Hamid Maleki, Mohammad Reza Safaei, Arturo S. Leon, Truong Khang Nguyen
pages 1299-1306
DOI: 10.1615/TFEC2019.epa.027962
$20.00