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First Thermal and Fluids Engineering Summer Conference

ISSN: 2379-1748
ISBN: 978-1-56700-430-4

Development and Demonstration of a Hybrid Heat Transfer Device

DOI: 10.1615/TFESC1.fnd.012897
pages 875-882

Steve Q. Cai
Teledyne Scientific, 1049 Camino Dos Rios, Thousand Oaks, CA, 91360, USA

Avijit Bhunia
Teledyne Scientific, 1049 Camino Dos Rios, Thousand Oaks, CA, 91360, USA


KEY WORDS: Evaporation, phase change, reverse osmosis membrane, heat flux

Abstract

With rapid development in electronic industries, compact electronic systems with high power dissipation raise critical needs on passive heat transfer technologies that are capable of high load heat transfer but have a low temperature drop. In this article, heat transfer characterizations of conventional heat pipe (CHP) and pulsating heat pipe (PHP) are conducted to fully understand their heat transfer merits and principles. By combining their operation mechanisms, a low thermal resistance and hybrid heat transfer device, hybrid heat pipe (HHP), is presented. Within the HHP, sintered metallic powders and grooves as wick structures are embedded in its tubes to reduce the evaporator dryout between each two oscillations and to enhance supply of operating fluid. Both the forced convection, in form of continuous oscillations, and interface phase change on the wick structure, contribute to the HHP heat transfer. Experimental results indicate that the HHP is capable of transferring heat 2-3 times higher than the CHP, and reduces over 60 percent temperature drop while compared with the PHP.

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