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First Thermal and Fluids Engineering Summer Conference

ISSN: 2379-1748
ISBN: 978-1-56700-430-4


Mohamed S. El-Genk
Institute for Space and Nuclear Power Studies; Mechanical Engineering Department; Nuclear Engineering Department, Chemical & Biological Engineering Dept., University of New Mexico, Albuquerque, New Mexico, 87131 USA

Arthur Suszko
Institute for Space and Nuclear Power Studies, Mechanical Engineering Dept., University of New Mexico, Albuquerque, NM, USA

Krishna Kota
Mechanical & Aerospace Engineering Dept., New Mexico State University, Las Cruces, NM, USA

DOI: 10.1615/TFESC1.mph.012561
pages 1991-1996

KEY WORDS: Dimpled copper surfaces, PF-5060 dielectric liquid, nucleate boiling enhancement, immersion cooling of electronics, critical heat flux, liquid subcooling, surface inclination


Pool boiling experiments are performed to investigate the effects of surface inclination on nucleate boiling heat transfer coefficient and the critical heat flux (CHF) for PF-5060 dielectric liquid on 10 ×10 mm, uniformly heated Copper (Cu) surfaces with machined circular dimples. The dimples, 300, 400, and 500 µm in diameter and 200 µm deep, have a triangular lattice with a pitch-to-diameter ratio of 2.0. The experiments varied the surface inclination angle from 0° (upward facing) to 180° (downward facing. In the upward facing orientation, the surface with 400 µm diameter dimples gives the highest maximum saturation boiling heat transfer coefficient, hMNB, of ~1.04-1.08 W/cm2 K and CHF of 19.3 W/cm2. The values of CHF and hMNB decrease with increasing inclination to the lowest values in the downward facing orientation of ~36% and ~33% of those in the upward facing orientation, respectively.

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