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First Thermal and Fluids Engineering Summer Conference

ISSN: 2379-1748
ISBN: 978-1-56700-430-4

THERMAL MODELING OF TABLETS: TEMPERATURE MANAGEMENT USING PHASE CHANGE MATERIALS

DOI: 10.1615/TFESC1.mph.012947
pages 2005-2018

Benjamin Sponagle
Dept. of Mechanical Engineering, Dalhousie University, Halifax, Nova Scotia, Canada

Dominic Groulx
Mechanical Engineering, Dalhousie University, Halifax, Nova Scotia, Canada, B3H 4R2


KEY WORDS: Phase Change Heat Transfer, Comsumer Electronics, Energy Storage, Numerical Modeling

Abstract

A numerical model, representative of a modern tablet computer, was constructed and used as a test bed for investigating the use of phase change material (PCM) thermal storage in the passive temperature control of modern portable . This numerical model was used in a study comparing the efficacy of PCM thermal storage with three different melting temperatures (Tm = 31.8°C, 43.3°C, and 55.8°C) during heating. It was found that the PCM thermal storage with a melting temperature of Tm = 31.8°C was far superior to the higher temperature cases. With a melting temperature of Tm = 31.8°C, the PCM thermal storage was excellent at delaying the overheating of the system on chip (SOC). It positively impacted the temperatures of both sides of the tablets, however, was not optimally placed to control the temperature of the front surface.

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