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ホーム アーカイブ 役員 今後の会合 American Society of Thermal and Fluids Engineering
Second Thermal and Fluids Engineering  Conference

ISSN: 2379-1748
ISBN: 978-1-56700-430-4

Fast Quenching on Porous Structured CuO Surface

Jun-young Kang
Division of Advanced Nuclear Engineering (DANE), Pohang University of Science and Technology (POSTECH), Pohang, 790-584, South Korea

Gi Cheol Lee
Department of Mechanical Engineering, Pohang University of Science and Technology (POSTECH), Pohang, 790-584, South Korea

Tong Kyun Kim
Division of Advanced Nuclear Engineering (DANE), Pohang University of Science and Technology (POSTECH), Pohang, 790-584, South Korea

Hyun Sun Park
Division of Advanced Nuclear Engineering (DANE), Pohang University of Science and Technology (POSTECH), Pohang, 790-584, South Korea

Moo Hwan Kim
Division of Advanced Nuclear Engineering (DANE), Pohang University of Science and Technology (POSTECH), Pohang, 790-584, South Korea; Department of Mechanical Engineering, Pohang University of Science and Technology (POSTECH), Pohang, 790-584, South Korea

DOI: 10.1615/TFEC2017.mnt.018047
pages 2693-2702

要約

We studied fast quenching on porous micro-structured surface under atmospheric and saturated water condition. Cupric oxide (CuO) micro-particle porous-layer coating was fabricated by electro-chemical deposition (ECD) at a brass sphere with the diameter of 15mm. The base diameter, height and particle diameter of micro-structures fabricated by the ECD are 20µm, 100µm, and 1µm, respectively. For the comparison, we prepared additional case of surface condition of which chemical composition is identical with the CuO; nano-structured surface (NS) and micro-/nano-structured surface (MNS). Quenching on the ECD surface is considerably faster than other surface conditions, and, this is originated by the minimum film boiling temperature Tmin enhancement. Through visualization in quenching, we can observe explosive fluctuation of the liquid-vapor interface on the ECD surface immediately after the initiation of the quenching. Based on the fin analysis, we concluded that liquidsolid contact in the high temperature could be explained by local cool-down at the tip of micro-structures, and, this can contribute to Tmin enhancement during quenching.

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