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COOLING ENHANCEMENT OF DROP IMPACT ON FLOWING LIQUID FILM

Xuan Gao
Nanyang Technological University, School of Mechanical & Aerospace Engineering

Ri Li
School of Engineering, University of British Columbia, 1137 Alumni Avenue, Kelowna, British Columbia V1V1V7, Canada

DOI: 10.1615/TFEC2017.hte.018061
pages 2133-2140

要約

A water drop impacts a thin heated wafer which is being cooled by a film flow generated from water jet impingement. The drop impact breaks the steady-state cooling and causes the local temperature around the drop landing location to change. Based on the surface temperature measurement, the surface temperature quickly decreases, and then recovers to the steady state. To evaluate the change of convection, an enhancement factor (η) based on the change of heat transfer coefficient is introduced. When most of the impact area reaches its local maximum enhancement (ηmax), the distribution of ηmax along the centerline of the impact area is referred as the maximum enhancement curve, and the peak value of the curve is referred to as the peak enhancement (ηp). It is found ηp does not follow a monotonic trend with increasing the impact velocity, but ηp increases with increasing the drop diameter and decreasing the flowing film rate.

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