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Experimental Study on the Pool and Flow Boiling Heat Transfer Enhancement for Silicon Chips with Microstructured Surfaces

Yonghai Zhang
State Key Laboratory of Multiphase Flow in Power Engineering, Xi'an Jiaotong University, Xi'an, Shaanxi, 710049, P.R. China; School of Chemical Engineering and Technology, Xi'an Jiaotong University, Xi'an 710049, China

Jinjia Wei
School of Chemical Engineering and Technology, Xi'an Jiaotong University, Xi'an, Shaanxi, 710049, P.R. China; Key Laboratory of Multiphase Flow in Power Engineering, Xi'an Jiaotong Uniersity, Xi'an, 710049, P.R.China

Yongchen Liu
School of Chemical Engineering and Technology, Xi'an Jiaotong University, Xi'an, Shaanxi, 710049, P.R. China

DOI: 10.1615/TFEC2017.hte.017523
pages 2085-2096

要約

An experimental study of pool boiling heat transfer was conducted for micro-pin-finned surfaces. The micro-pinfinned surfaces had different pitches, configurations and shapes. The experimental condition covered three different liquid subcoolings (15K, 25K, 35K), and dielectric liquid FC-72 was used as working fluid. Fin pitch was found to have significant effects on the boiling heat transfer coefficient and critical heat flux, but the influence was not monotonous. Surface with removed micro-pin-fins showed higher HTC and CHF than aligned micro-pin-fins, which was owing to the enhancement of capillary flow performance. Compared with square micro-pin-fins, circular micro-pin-fins demonstrated excellent heat transfer performance under the same surface area, and the critical heat flux was increased by 13%. Besides, heat transfer performance of flow boiling over micro-pin-finned surfaces was investigated under the conditions of liquid subcooling of 35K and three different liquid velocities (0.5m/s, 1 m/s, 2 m/s). Three pitches (45μm, 60μm, 75μm) were chosen for staggered square micro-pin-fins of 30μm×60μm (named S-SPF30-60-45, S-SPF30-60-60, S-SPF30-60-75). The effects of pin pitch, configuration and shape on flow boiling heat transfer were also explored. In single-phase region, the slope of boiling curve increased with the pin pitch increasing. The critical heat flux of S-SPF30-60-60 and S-SPF30- 60-75 were comparative, whereas the S-SPF30-60-45 showed the lowest CHF.

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