ISSN Online: 2379-1748
ISBN Flash Drive: 978-1-56700-431-1
ISBN Online: 978-1-56700-430-4
First Thermal and Fluids Engineering Summer Conference
NUMERICAL INVESTIGATION OF FORCED CONVECTION THERMAL MANAGEMENT OF HIGH POWER ELECTRONICS ON A ROTARY PLATFORM
要約
An package on a rotary platform including two components with 600 W, one component with 350 W
and one small component with 70 W heat dissipation rates (1620 W total heat load) is numerically and
experimentally investigated under steady state conditions. In order to avoid rotary joints and to reduce the cost,
the thermal management solution for the heat dissipation is placed entirely on the rotary platform. The thermal
management solution consists of heat sinks attached on vertical side surfaces of the platform. The heat
dissipating components are connected to the heat sinks with heat pipes. The heat sinks are covered with cover
plates to form flow channels that are used for forced convection heat transfer with the help of high power fan
assemblies. The thermal management system is numerically modeled and then the numerical model is validated
with the help of a set of experiments. The validated model is used for the optimization of the system. The
optimization parameters are the heat pipe locations and their connections to the heat sinks. The optimization
parameters are the heat pipe locations, their dimensions, their connections to the heat sinks and fin structures
of the heat sinks. The optimization criterion is to maintain nearly uniform temperature distributions on the
heat sinks. The constraints are the lengths of the standard heat pipes and the limited options to bend the heat pipes due to their fragile structures. The system can keep the hot spot temperatures below the allowed maximum
temperature of 120 °C even for the case of 50 °C ambient air temperature.