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Главная Архив Оргкомитет Будущие конференции American Society of Thermal and Fluids Engineering
First Thermal and Fluids Engineering Summer Conference

ISSN: 2379-1748


Benjamin Sponagle
Dept. of Mechanical Engineering, Dalhousie University, Halifax, Nova Scotia, Canada

Dominic Groulx
Mechanical Engineering, Dalhousie University, Halifax, Nova Scotia, Canada, B3H 4R2

DOI: 10.1615/TFESC1.mph.012947
pages 2005-2018

Ключевые слова: Phase Change Heat Transfer, Comsumer Electronics, Energy Storage, Numerical Modeling


A numerical model, representative of a modern tablet computer, was constructed and used as a test bed for investigating the use of phase change material (PCM) thermal storage in the passive temperature control of modern portable . This numerical model was used in a study comparing the efficacy of PCM thermal storage with three different melting temperatures (Tm = 31.8°C, 43.3°C, and 55.8°C) during heating. It was found that the PCM thermal storage with a melting temperature of Tm = 31.8°C was far superior to the higher temperature cases. With a melting temperature of Tm = 31.8°C, the PCM thermal storage was excellent at delaying the overheating of the system on chip (SOC). It positively impacted the temperatures of both sides of the tablets, however, was not optimally placed to control the temperature of the front surface.

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