One of the most commonly used techniques for heat enhancement in heat exchanger devices is the dimple surface flow augmentation concept. In this study, compound dimple effect in a rectangular channel computational domain is investigated. Two (2) dimple arrangement with changing position of 45° oval angled dimple and a pitch to depth ratio of four are used in the investigation. The respective surface profiles present for aspect ratios of 0.025 are tested for channel heights of 5 mm. The plane surface profile of the oval dimple in both plates are presented to understand the behaviours and performance process of these dimple profile. This subsequently provides information on how and which arrangement gives the best performance for heat transfer Nusselt numbers, and moderate pressure drop, friction factors, in the compound dimple arrangement. The computation simulation is carried out for Re, which ranges from 600 to 11000 however the flow augmentation, temperature distribution and velocity profile for Re 11000 is presented. All the contour and plane section plots show uniform flow distribution. The flow is evenly dispersed throughout the channel, as indicated by the surface temperature at three different cutout points. Re has a significant impact, which is consistent across the surfaces. The compound dimple does provide a reliable model for heat exchanger device application.