The utilization of flow boiling heat transfer in microchannels has become prevalent to efficiently dissipate substantial heat fluxes generated by electronic devices. In recent years, there has been an increasing amount of research focused on the investigation of single-phase heat transfer utilizing coolant and refrigerant. The current focus in the field of heat transfer has shifted towards multiphase heat transfer due to the advent of advanced technologies that exhibit very high heat fluxes. This study aims to evaluate the impact of interconnected microchannels on the flow boiling behavior of water within counterflow parallel channels. The study demonstrates that interconnectors facilitate the flow of cooling water from parallel channels, hence aiding in the disruption of the thermal boundary layer and vapor layer adjacent to the channel wall. The mass flux is varied over a range of values (400, 600, 800, 1000, 1200, and 1400 kg/m²s) in order to investigate the effects on sink temperature, Nusselt number, and pressure drop. This analysis is conducted for both interconnected and non-interconnected cases, while also considering variable heat fluxes. The flow boiling curves have been examined to gain insight into the heat dissipation capabilities of interconnected microchannels. The findings of this study indicate that an increase in the mass flux with interconnectors has resulted in an enhanced ability to disperse higher levels of heat flux (>100 W/cm²) with higher mass fluxes. Furthermore, it has been observed that the temperature of the chip surface was lower when interconnectors were present.