To address the shortcomings of currently employed two-phase cooling technologies for thermal management of high heat flux electronics, a hybrid two-phase cooling system (HTPCS) was developed and demonstrated to exhibit excellent performance in previous works. The HTPCS integrates the benefits of pumped two-phase cooling and capillary-driven two-phase cooling relying on evaporation from wick structures. However, despite substantial improvement of thermal performance of state-of-the-arts cold plates achieved in previous works, the commercialization of the developed HTPCS requires further improvement, mainly in fabrication of the cold plate. The goal of the present study is to address the challenges inherent in the current fabrication approach adopted for making cold plates, aiming to enhance the performance of the current cold plate design employed in the HTPCS. Subsequently, recommendations are proposed to improve the cold plate's reliability, thereby facilitating the commercialization of the HTPCS as a promising thermal management solution for high-heat-density electronics.