RECOVERING THERMAL CONTACT CONDUCTANCES IN THREE–DIMENSIONAL LAYERED MATERIALS VIA RECIPROCITY FUNCTIONAL ANALYSIS AND TSVD REGULARIZATION TECHNIQUE
This paper presents a methodology, based on the Reciprocity Function approach, for the estimation of a two–dimensional thermal contact conductance in a transient three–dimensional heat conduction problem. Thermal contact conductances appear on the contact surface between two materials that are put in contact, due to the presence of some irregularities in such interface. The technique presented in this paper allows
to estimate the heat flux and the temperature jump, both on the thermal contact interface, leading to the
estimation of the thermal contact conductance. In the proposed technique, temperature measurements can be
taken non-intrusively on the external surface of the materials. The method gives good estimates, even when
noisy measurements are considered.