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ホーム アーカイブ 役員 今後の会合 American Society of Thermal and Fluids Engineering

ISSN オンライン: 2379-1748

ISBN 印刷: 978-1-56700-472-4 (Flash Drive)

ISBN オンライン: 978-1-56700-471-7

3rd Thermal and Fluids Engineering Conference (TFEC)
March, 4–7, 2018, Fort Lauderdale, FL, USA

RECOVERING THERMAL CONTACT CONDUCTANCES IN THREE–DIMENSIONAL LAYERED MATERIALS VIA RECIPROCITY FUNCTIONAL ANALYSIS AND TSVD REGULARIZATION TECHNIQUE

Get access pages 367-376
DOI: 10.1615/TFEC2018.ces.020922

要約

This paper presents a methodology, based on the Reciprocity Function approach, for the estimation of a two–dimensional thermal contact conductance in a transient three–dimensional heat conduction problem. Thermal contact conductances appear on the contact surface between two materials that are put in contact, due to the presence of some irregularities in such interface. The technique presented in this paper allows to estimate the heat flux and the temperature jump, both on the thermal contact interface, leading to the estimation of the thermal contact conductance. In the proposed technique, temperature measurements can be taken non-intrusively on the external surface of the materials. The method gives good estimates, even when noisy measurements are considered.
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