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ホーム アーカイブ 役員 今後の会合 American Society of Thermal and Fluids Engineering

ISSN オンライン: 2379-1748

ISBN 印刷: 978-1-56700-517-2 (Flash drive)

5-6th Thermal and Fluids Engineering Conference (TFEC)
May, 26–28, 2021 , Virtual

CONJUGATE HEAT TRANSFER ENHANCEMENT USING OPTIMAL PLACEMENT OF HEATED MODULES UNDER FORCED CONVECTION

Get access pages 1005-1011
DOI: 10.1615/TFEC2021.hte.032394

要約

This paper presents conjugate heat transfer enhancement using optimal placement of heated modules under forced convection air cooling. Heat transfer from solids and fluid was studied experimentally and numerically to investigate heat transfer characteristics individually. Fifteen rectangular discrete aluminum heated modules of unequal sizes are used to find optimal placement numerically using commercially available finite element based simulation software. Laminar forced convection heat transfer experiments are conducted for different configurations obtained numerically. Flowing air velocities of 0.6 - 1.4 m/s are considered with constant heat flux values of 1000, 2000 and 2500 W/m2. Conjugate heat transfer for three-dimensional laminar developing flows over heated modules; representing integrated circuit components for electronic cooling have been studied. Experiments are conducted using single layer and multilayer copper clad boards as substrate materials having thermal conductivities of 8.8 and 40.5 W/m K to study the effects of substrate thermal conductivity on fluid flow and heat transfer characteristics. The optimal configuration is one that gives enhancement in heat transfer is identified. Numerical simulation results are validated with experiments and are in good agreements.
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