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ISSN Online: 2379-1748
ISBN Flash Drive: 978-1-56700-431-1
ISBN Online: 978-1-56700-430-4
First Thermal and Fluids Engineering Summer Conference
Development and Demonstration of a Hybrid Heat Transfer Device
要約
With rapid development in electronic industries, compact electronic systems with high power dissipation
raise critical needs on passive heat transfer technologies that are capable of high load heat transfer but have a
low temperature drop. In this article, heat transfer characterizations of conventional heat pipe (CHP) and
pulsating heat pipe (PHP) are conducted to fully understand their heat transfer merits and principles. By
combining their operation mechanisms, a low thermal resistance and hybrid heat transfer device, hybrid heat
pipe (HHP), is presented. Within the HHP, sintered metallic powders and grooves as wick structures are
embedded in its tubes to reduce the evaporator dryout between each two oscillations and to enhance supply
of operating fluid. Both the forced convection, in form of continuous oscillations, and interface phase change
on the wick structure, contribute to the HHP heat transfer. Experimental results indicate that the HHP is
capable of transferring heat 2-3 times higher than the CHP, and reduces over 60 percent temperature drop
while compared with the PHP.