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Início Arquivos Representantes Futuras reuniões American Society of Thermal and Fluids Engineering

ISSN On-line: 2379-1748

ISBN Imprimir: 978-1-56700-517-2 (Flash drive)

5-6th Thermal and Fluids Engineering Conference (TFEC)
May, 26–28, 2021 , Virtual

NUMERICAL SIMULATION ON PRINTED CIRCUIT BOARDS FOR HIGH HEAT FLUXES UNDER FORCED AIR COOLING SYSTEM

Get access pages 1077-1083
DOI: 10.1615/TFEC2021.hte.032462

Resumo

This paper presents numerical investigation on forced convection air cooling of high thermal conductivity printed circuit boards for high heat fluxes. Flowing air velocities of 2 - 6 m/s have been employed at uniform heat flux values. Full three dimensional, steady state, laminar, incompressible, developing flow was considered. Finite element based commercially available Comsol Multiphysics 4.3b software is used to solve Navier-Stokes equations to study a coupling between heat transfer in solids and fluids. Single layer and multilayer copper clad boards having thermal conductivities of 8.8 and 40.5 W/m K are considered as substrate materials. Effect of thermal conductivity on heat transfer characteristics under forced convection air cooling have been studied. Fifteen aluminum discrete square heat sources of sizes 15 × 15 × 5 mm each are mounted on substrate board that mimic electronic chips on printed circuit boards. Two different thermal conductivity substrate boards mounted with aluminum heat sources are considered for high heat flux values of 4000, 8000, 12000 W/m2, respectively. Results of temperature plots show that multilayer copper clad board is suitable for all high heat flux values considered for the configuration used in this study. Single layer copper clad substrate board is capable of dissipate heat from electronic component efficiently for the heat flux values of 4000 - 12000 W/m2 except in case of high heat flux value of 12000 W/m2 with low velocity of 2 m/s.
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