ISSN Online: 2379-1748
ISBN Flash Drive: 978-1-56700-469-4
ISBN Online: 978-1-56700-470-0
Second Thermal and Fluids Engineering Conference
STUDY OF THERMAL TRANSPORT AND THERMAL STRESS IN THIN METAL FILM-GLASS SUBSTRATE SYSTEM
Аннотация
Solid state thermoelectric devices are desirable for various sustainable applications. Most of these thin film
devices are multilayered structures which requires thorough understanding of thermal transport and thermal
stress in order to solve thermal issues. In this paper the experimental technology as well as theoretical model of
long delay time pump-probe study with four different illumination configurations have been developed to
comprehensively characterize the thermal transport and thermal stress of thin film, substrate and the interface.
Furthermore, Pt and Mo films-glass substrate systems have been studied by applying time-domain
thermoreflectance measurements under four illumination configurations with high signal quality. The obtained
time-dependent temperature signal is superposed by the effects of multilayered thermal transport and thermal
stress spontaneously, and the corresponding theoretical predictions match well with the experimental data in the
whole delay time range. The determined thermal conductivity of the Pt and Mo films shows significant size
effect.