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ISSN Online: 2379-1748

ISBN Flash Drive: 978-1-56700-469-4

ISBN Online: 978-1-56700-470-0

Second Thermal and Fluids Engineering Conference
April, 2-5, 2017, Las Vegas, NV, USA

STUDY OF THERMAL TRANSPORT AND THERMAL STRESS IN THIN METAL FILM-GLASS SUBSTRATE SYSTEM

Get access (open in a dialog) pages 2651-2653
DOI: 10.1615/TFEC2017.mnt.018037

摘要

Solid state thermoelectric devices are desirable for various sustainable applications. Most of these thin film devices are multilayered structures which requires thorough understanding of thermal transport and thermal stress in order to solve thermal issues. In this paper the experimental technology as well as theoretical model of long delay time pump-probe study with four different illumination configurations have been developed to comprehensively characterize the thermal transport and thermal stress of thin film, substrate and the interface. Furthermore, Pt and Mo films-glass substrate systems have been studied by applying time-domain thermoreflectance measurements under four illumination configurations with high signal quality. The obtained time-dependent temperature signal is superposed by the effects of multilayered thermal transport and thermal stress spontaneously, and the corresponding theoretical predictions match well with the experimental data in the whole delay time range. The determined thermal conductivity of the Pt and Mo films shows significant size effect.